Thermal property evaluation of a 2.5D integration method with device level microchannel direct cooling for a high-power GaN HEMT device
oleh: Tingting Lian, Yanming Xia, Zhizheng Wang, Xiaofeng Yang, Zhiwei Fu, Xin Kong, Shuxun Lin, Shenglin Ma
| Format: | Article |
|---|---|
| Diterbitkan: | Nature Publishing Group 2022-11-01 |
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