Mechanical, Dielectric, and Thermal Attributes of Polyimides Stemmed Out of 4, 4’–Diaminodiphenyl Ether

oleh: Panpan Zhang, Ke Zhang, Shuliang Dou, Jiupeng Zhao, Xiangqiao Yan, Yao Li

Format: Article
Diterbitkan: MDPI AG 2020-03-01

Deskripsi

Several kinds of polyimide (PI) films stemmed out of 4, 4&#8217;&#8722;diaminodiphenyl ether, as well as various structurally various aromatic dianhydride, were prepared. The films&#8217; mechanical, dielectric, and dynamic mechanical attributes were put under investigation. According the findings, the PI films&#8217; performance is significantly different as a result of their diverse structure. PI&#8217;s dielectric constant and dielectric loss tangent of abides by the increasing order below: PMDA-PI&gt;BTDA-PI&gt;BPDA-PI. Moreover, the electric breakdown strength of BTDA-PI (478.90 kV/mm) presents a lot higher value compared to the one PMDA-PI (326.80 kV/mm) and BPDA-PI (357.07 kV/mm). In particular, BTDA-PI film possesses high electric breakdown strength about 478.90 kV/mm. In addition, PI&#8217;s glass transition temperature (T<sub>g</sub>) are, respectively, 276 &#176;C (BTDA-PI), and 290 &#176;C (BPDA-PI), as well as 302 &#176;C (PMDA-PI). Therefore, in virtue of their various structures and performances, practical applications of PI films can exert significant role in the electronics and microelectronics industries.