Supercritical CO<sub>2</sub>-Assisted Electroless Plating of Ultrahigh-Molecular-Weight Polyethylene Filaments for Weavable Device Application

oleh: Hikaru Kondo, Tomoyuki Kurioka, Wan-Ting Chiu, Chun-Yi Chen, Jhen-Yang Wu, Tso-Fu Mark Chang, Machiko Yamaguchi, Hiromichi Kurosu, Masato Sone

Format: Article
Diterbitkan: MDPI AG 2024-06-01

Deskripsi

This study reports on the use of supercritical CO<sub>2</sub> (scCO<sub>2</sub>) for the metallization of ultrahigh-molecular-weight polyethylene (UHMW-PE) filaments, which are used as functional components in weavable devices. UHMW-PE is well known for its chemical and impact resistance, making it suitable for use in bulletproof clothing and shields. However, its chemical resistance poses a challenge for metallization. By utilizing scCO<sub>2</sub> as the solvent in the catalyzation process, a uniform and defect-free layer of Ni-P is successfully deposited on the UHMW-PE filaments. The deposition rate of Ni-P is enhanced at higher temperatures during the scCO<sub>2</sub> catalyzation. Importantly, the durability of the Ni-P-metalized UHMW-PE filaments is improved when the scCO<sub>2</sub> catalyzation is carried out at 120 °C, as evidenced by minimal changes in electrical resistivity after a rolling test.