Find in Library
Search millions of books, articles, and more
Indexed Open Access Databases
Supercritical CO<sub>2</sub>-Assisted Electroless Plating of Ultrahigh-Molecular-Weight Polyethylene Filaments for Weavable Device Application
oleh: Hikaru Kondo, Tomoyuki Kurioka, Wan-Ting Chiu, Chun-Yi Chen, Jhen-Yang Wu, Tso-Fu Mark Chang, Machiko Yamaguchi, Hiromichi Kurosu, Masato Sone
Format: | Article |
---|---|
Diterbitkan: | MDPI AG 2024-06-01 |
Deskripsi
This study reports on the use of supercritical CO<sub>2</sub> (scCO<sub>2</sub>) for the metallization of ultrahigh-molecular-weight polyethylene (UHMW-PE) filaments, which are used as functional components in weavable devices. UHMW-PE is well known for its chemical and impact resistance, making it suitable for use in bulletproof clothing and shields. However, its chemical resistance poses a challenge for metallization. By utilizing scCO<sub>2</sub> as the solvent in the catalyzation process, a uniform and defect-free layer of Ni-P is successfully deposited on the UHMW-PE filaments. The deposition rate of Ni-P is enhanced at higher temperatures during the scCO<sub>2</sub> catalyzation. Importantly, the durability of the Ni-P-metalized UHMW-PE filaments is improved when the scCO<sub>2</sub> catalyzation is carried out at 120 °C, as evidenced by minimal changes in electrical resistivity after a rolling test.