Fabrication and Characterizations of PbZr<sub>x</sub>Ti<sub>1-x</sub>O<sub>3</sub> (PZT) Ultrasonic Sensing Chips
oleh: Ming-Ling Lee, Shih-Ming Chen, Jia-Jie Jhang, Lin-Sin Lu, Shu-Ting Yang, Pin-En Chiu, Yu-Sheng Tsai, Yewchung Sermon Wu, Chin-Chi Cheng, Hsiang Chen, Jung Han
| Format: | Article |
|---|---|
| Diterbitkan: | IEEE 2022-01-01 |
Deskripsi
PbZr<sub>x</sub>Ti<sub>1-x</sub>O<sub>3</sub> (PZT) ultrasonic sensing chips were fabricated by ball milling, electrical discharge and spraying on iron sheets. Various PZT growth conditions, including the thickness of the iron sheet and the coating layers, were investigated. Ultrasonic sensing measurements indicated that PZT chips of sufficient thickness and with 6 or 9 coating layers exhibited ultrasonic sensing capability. Further, multiple material and electrical characterizations revealed that while sufficient thickness and low leakage were required, uniform growth of the film and a grain size of approximately 150 nm were preferable for ultrasonic sensing. Their compact size, rapid response, and low cost make PZT-based ultrasonic sensors promising for future ultrasonic detection application.