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The effect of aging time on the deformation behavior of lead-free and lead- based sub-mm solder alloys were investigated. Experimental results showed that the aging time (less than 4 hours) did not have any effect on the anisotropy behavior of Tin solder balls during compression processes but that is clear in other intervals time specially when the aging time increased, and the microstructure images show different grain growth in high temperature longer time and the Tin anisotropic behavior in lead-free solder alloys