Rooting binder-free tin nanoarrays into copper substrate via tin-copper alloying for robust energy storage
oleh: Jiangfeng Ni, Xiaocui Zhu, Yifei Yuan, Zhenzhu Wang, Yingbo Li, Lu Ma, Alvin Dai, Matthew Li, Tianpin Wu, Reza Shahbazian-Yassar, Jun Lu, Liang Li
| Format: | Article |
|---|---|
| Diterbitkan: | Nature Portfolio 2020-03-01 |
Deskripsi
The authors here report a binder-free electrode based on tin nanoarrays deposited on copper substrate. It is found that the locally formed electrochemically inactive tin-copper alloys work as a glue that bridges tin and copper to survive harsh cycling conditions in sodium ion batteries.