Flip Chip Packaging of Digital Silicon Photonics MEMS Switch for Cloud Computing and Data Centre
oleh: How Yuan Hwang, Jun Su Lee, Tae Joon Seok, Alex Forencich, Hannah R. Grant, Dylan Knutson, Niels Quack, Sangyoon Han, Richard S. Muller, George C. Papen, Ming C. Wu, Peter O'Brien
| Format: | Article |
|---|---|
| Diterbitkan: | IEEE 2017-01-01 |
Deskripsi
We report on the flip chip packaging of Micro-Electro-Mechanical System (MEMS)-based digital silicon photonic switching device and the characterization results of 12 × 12 switching ports. The challenges in packaging N<sup> 2</sup> electrical and 2N optical interconnections are addressed with single-layer electrical redistribution lines of 25 <italic>μ</italic>m line width and space on aluminum nitride interposer and 13° polished 64-channel lidless fiber array (FA) with a pitch of 127 <italic>μ</italic>m. 50 <italic>μ</italic>m diameter solder spheres are laser-jetted onto the electrical bond pads surrounded by suspended MEMS actuators on the device before fluxless flip-chip bonding. A lidless FA is finally coupled near-vertically onto the device gratings using a 6-degree-of-freedom (6-DOF) alignment system. Fiber-to-grating coupler loss of 4.25 dB/facet, 10<sup>–11 </sup> bit error rate (BER) through the longest optical path, and 0.4 <italic>μ</italic>s switch reconfiguration time have been demonstrated using 10 Gb/s Ethernet data stream.