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We demonstrate a new method that can simultaneously improve the strength and toughness of the glass fiber-reinforced bismaleimide–triazine (BT) resin composites by using polyethylene glycol (PEG) to construct a flexible bridge at the interface. The mechanical properties, including the elongation, ultimate tensile stress, Young's modulus, toughness and dynamical mechanical properties were studied as a function of the length of PEG molecular chain. It was found that the PEG molecule acts as a bridge to link BT resin and glass fiber through covalent and non-covalent bondings, respectively, resulting in improved interfacial bonding. The incorporation of PEG produces an increase in elongation, ultimate tensile stress and toughness. The Young's modulus and Tg were slightly reduced when the length of the PEG molecular chain was high. The elongation of the PEG-modified glass fiber-reinforced composites containing 5 wt% PEG-8000 increased by 67.1%, the ultimate tensile stress by 17.9% and the toughness by 78.2% compared to the unmodified one. This approach provides an efficient way to develop substrate material with improved strength and toughness for integrated circuit packaging applications.