Find in Library

To further improve the manufacturing process and product performance of decorated bamboo filament board, the Box–Behnken response surface analysis method was used to analyze the correlation between the hot-pressing parameters and surface bonding strength, and the optimal process optimization parameters were obtained. In addition, the wettability and color of each group of samples were tested. The results show that the optimum process parameters of decorated bamboo filament boards were 130 °C, 165 s and 2.00 MPa, and the surface bonding strength was 1.58 MPa. The relative error between the measured value and the predicted value was less than 5%. The contact angle of the bamboo filament after hot pressing was higher than without hot pressing. However, there was no correlation between wettability and the hot-pressing parameters. There was no effect on the change in bamboo surface color. This indicates that the temperature range selected in this study meets the requirements of surface color control in production.