Simulation on the Interfacial Singular Stress-strain Induced Cracking of Microelectronic Chip Under pPower On-off Cycles
oleh: X. Huang, X. Huang
| Format: | Article |
|---|---|
| Diterbitkan: | MIDEM Society - Society for Microelectronics, Electronic Components and Materials 2019-09-01 |
Deskripsi
Subjek
Thermal fatigue; microelectronic chip; creep; singular field; crack nucleation