Ultralow Interfacial Thermal Resistance of Graphene Thermal Interface Materials with Surface Metal Liquefaction
oleh: Wen Dai, Xing-Jie Ren, Qingwei Yan, Shengding Wang, Mingyang Yang, Le Lv, Junfeng Ying, Lu Chen, Peidi Tao, Liwen Sun, Chen Xue, Jinhong Yu, Chengyi Song, Kazuhito Nishimura, Nan Jiang, Cheng-Te Lin
| Format: | Article |
|---|---|
| Diterbitkan: | SpringerOpen 2022-12-01 |
Deskripsi
Highlights A three-tiered thermal interface materials was proposed with the through-plane thermal conductivity up to176 W m−1 K−1 and contact thermal resistance as low as 4–6 K mm2 W−1 (double sides). The liquid metal acts as a buffer layer to connect vertically aligned graphene with the rough heater/heat sink, improving effective contact thermal conductance by more than an order of magnitude.