Low-temperature transient liquid phase bonding via electroplated Sn/In–Sn metallization
oleh: Chin-Hao Tsai, Han-Tang Hung, Fu-Ling Chang, Steffen Bickel, Maik Müller, Iuliana Panchenko, Karlheinz Bock, C.R. Kao
| Format: | Article |
|---|---|
| Diterbitkan: | Elsevier 2022-07-01 |
Deskripsi
Sn/In–Sn bonding interfaces obtained by the transient liquid phase (TLP) reaction were investigated for applications in low-temperature assembly. Bonding was achieved at temperatures below 150 °C with a low bonding pressure. Although a few voids were formed at the interfaces after bonding, the In–Sn metallization enabled low-temperature bonding due to the low eutectic temperature. A bonding mechanism to achieve this novel In–Sn low-temperature assembly was also proposed.