Microstructure and chemical data of the thermoelectric ZnSb material after joining to metallic electrodes and heat treatment
oleh: Safdar Abbas Malik, Le Thanh Hung, Ngo Van Nong
| Format: | Article |
|---|---|
| Diterbitkan: | Elsevier 2017-12-01 |
Deskripsi
The data presented in this article are related to the research article entitled: âSolder free joining as a highly effective method for making contact between thermoelectric materials and metallic electrodesâ (Malik et al., 2017) [1]. This article presents microstructure obtained by scanning electron microscopy (SEM) and chemical analysis by energy dispersive X-ray spectroscopy (EDX) point measurements of the thermoelectric ZnSb legs after joining to metallic electrodes using solder (Zn-2Al) and free-soldering methods.