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In order to obtain the curing reaction temperature parameters of E-glass fiber/epoxy resin prepreg, DSC was carried out. Kissinger and Crane equations were used to obtain the phenomenological <i>n</i>^th-order reaction curing kinetic parameters of the prepreg. The optimal curing temperature of the prepreg was obtained by <i>T-β</i> extrapolation method, and the phenomenological curing kinetic model of the prepreg was established. Monolayer board and laminate of[0]₁₀ were prepared by molding process. The dynamic thermodynamic properties of the prepreg were studied by dynamic mechanical analysis (DMA). The results show that the apparent activation energy and the reaction order of the prepreg are 87.8 kJ/mol and 0.93, respectively. The glass transition temperature <i>T</i>_g of the laminates is 130-133℃. The loss factor tan<i>δ</i> of[0]₁₀ laminate is higher than that of monolayer board.