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Sheets of aluminum 7075 and titanium Ti-6Al-4V alloys were successfully joined using the spark plasma sintering (SPS) process. A copper foil was placed as an interlayer between the two surfaces. The bonding was made at 480 °C, 500 °C, and 520 °C with a holding time of 10 min and under a uniaxial pressure of 5 MPa and 10 MPa. The obtained bonds were analyzed by scanning electron microscopy, energy dispersive spectroscopy (SEM/EDS), and wavelength dispersive spectroscopy (WDS). It was found that copper diffused away through Al7075 and formed Al₂Cu intermetallics but was not present at the joint region. The investigation of the fractured surfaces using X-ray diffraction (XRD) showed that the joint region contained TiAl₃, TiAl₂, and Ti₃Al intermetallic compounds. The presence of the Cu foil was believed to hinder the formation of Al₃Ti observed in previous studies by allowing more Ti to diffuse into the Al side.