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In this work a simplified low-frequency resonant method for the measurement of Young’s modulus of polysilicon cantilevers is described. We used a test chip, specially designed for characterizing thermal and mechanical properties, and fabricated using a combined bulk/surface micromachining process. In this regard, an opto-mechanical set up for the measurement of Young’s modulus is described. We use this set up for the characterization of 50 μm-wide, 1.0 μm-thick and 200–325 μm-long polysilicon cantilevers, under a mechanical excitation in the kHz frequency range.