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Effect of sintering process on microstructure and properties of Al–Si alloy made by powder metallurgy for electronic packaging application
oleh: Zhaoyang Kong, Haibin Huang, Yingmin Li, Baoyi Yu, Bin Chen, Runxia Li
| Format: | Article |
|---|---|
| Diterbitkan: | IOP Publishing 2023-01-01 |
Deskripsi
The impact of the sintering temperature on the microstructure and characteristics of Al–Si composite was investigated in this study. Al-60Si (wt%) composites were sintered at different temperatures, and the microstructural features were evaluated. Optimal microstructural characteristics were observed when the composites were sintered at 850 °C for 2 h. The resulting material exhibited a thermal conductivity, coefficient of thermal expansion, and relative density of 131.4 W/(m·K), 10.02 × 10 ^–6 K ^–1 , and 99.87%, respectively. Elevating the temperature facilitated better wettability of the material, which in turn aided the filling of voids within the material by liquid Al. In addition, a decrease in the total number of interfaces within the material and the establishment of a connected network by the Al matrix contributed to enhanced thermal conductivity and coefficient of thermal expansion.