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A novel packaged filtering balun is proposed by modifying quarter-mode edge and diagonally folded SIW (FSIW) cavities. The TM₂₂₀ mode is selected to realize the differential signal conversion by using a quarter-mode diagonally FSIW. Furthermore, TM₁₃₀, and TM₃₃₀ modes are obtained by using a quarter-mode edge FSIW cavity by analyzing the mode field distributions. A W band packaged filtering balun is designed and simulated. Then, it is fabricated with 70 <inline-formula> <tex-math notation="LaTeX">$\mu {\mathrm{ m}}$ </tex-math></inline-formula> thickness per layer based on our in- house Si-based MEMS photosensitive film process. The size of the filtering balun is only <inline-formula> <tex-math notation="LaTeX">$2.83~\lambda \text{g}^{2}$ </tex-math></inline-formula> with insertion loss of 3 &#x002B; 1.8 dB. These types of packaged filtering balun are very suitable for future 3D heterogeneous integration with other semiconductor devices.