Corrigendum to “Comparative study of solder wettability on aluminum substrate and microstructure-properties of Cu-based component/aluminum laser soldering joint” [Mater. Design 215 (2022) 110485]
oleh: Peng-Cheng Huan, Xiao-Xia Tang, Qian Sun, Kato Akira, Xiao-Nan Wang, Jie Wang, Jia-Le Wang, Xia Wei, Hong-Shuang Di
| Format: | Article |
|---|---|
| Diterbitkan: | Elsevier 2022-07-01 |
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