Research on Modeling and Experiment of Glass Substrate Peeling Based on Adhesion Theory
oleh: Liwei Hou*, Hengsheng Wang, Runhua Liu
| Format: | Article |
|---|---|
| Diterbitkan: | Faculty of Mechanical Engineering in Slavonski Brod, Faculty of Electrical Engineering in Osijek, Faculty of Civil Engineering in Osijek 2019-01-01 |
Deskripsi
In this paper, the peeling of glass substrates is modeled, in a setting of automatic polishing and grinding for flat panel display glass substrates. The mechanical model of glass substrates-adhesive pad structure is established. The vacuum adsorbing force between them is regarded as adhesive force. The model is simplified as a distributed spring group which can describe the desorption and shear behavior of the glass substrates-adhesive pad structure. The corresponding analytical solution method is proposed. Finally, experiment is conducted to verify the accuracy and feasibility of the proposed mechanical model.