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The In–Bi–Sn low-temperature solder alloys are regarded as potential candidates for cryogenic and space exploration applications. This study investigates the variations in the mechanical properties and microstructures of two different compositions: In15wt%Bi35wt%Sn and In30wt%Bi20wt%Sn, after exposure to a low-temperature environment (−20 °C) for 10 months. An increase in the ultimate tensile strength was observed across all the tested samples and a decrease in elongation to failure was observed in In30wt%Bi20wt%Sn. Changes in the microstructure were identified through scanning electron microscopy (SEM) and electron backscatter diffraction (EBSD). The impact of this low-temperature environment is described, considering the varying proportions and compositions of the three phases (BiIn₂(Sn), γ-InSn₄(Bi), and β-In₃Sn(Bi)) present within the alloys and their contribution to the mechanical properties.