Nanoscale evolution of interface morphology during electrodeposition
oleh: Nicholas M. Schneider, Jeung Hun Park, Joseph M. Grogan, Daniel A. Steingart, Haim H. Bau, Frances M. Ross
| Format: | Article |
|---|---|
| Diterbitkan: | Nature Portfolio 2017-12-01 |
Deskripsi
Understanding structure evolution during electrochemical growth is crucial in materials processing and design of devices such as batteries. Here, the authors image copper during electrodeposition to provide strategies for controlling interface morphology.