Chip-Level 1 <formula formulatype="inline"><tex Notation="TeX">$\times$</tex></formula> 2 Optical Interconnects Using Polymer Vertical Splitter on Silicon Substrate
oleh: Chin-Ta Chen, Po-Kuan Shen, Teng-Zhang Zhu, Chia-Chi Chang, Shu-Shuan Lin, Mao-Yuan Zeng, Chien-Yu Chiu, Hsu-Liang Hsiao, Hsiao-Chin Lan, Yun-Chih Lee, Yo-Shen Lin, Mount-Learn Wu
| Format: | Article |
|---|---|
| Diterbitkan: | IEEE 2014-01-01 |
Deskripsi
The chip-level 1 × 2 optical interconnects using the polymer vertical splitter developed on a silicon substrate are demonstrated. The 1 × 2 vertical-splitting configuration is realized using a polymer waveguide terminated at three silicon 45 <sup>°</sup> reflectors. The high-frequency transmission lines combined with the indium solder bumps are developed to flip-chip assemble a vertical-cavity surface-emitting laser chip at the input port and two photodetector chips at two output ports. Total transmission loss of -3.26 dB with a splitting ratio of 1 : 1 for the proposed splitter is experimentally obtained. A 10-Gbit/s data transmission with bit error rates better than 10<sup>-12</sup> for two output ports is achieved. It reveals that such chip-level 1 × 2 optical interconnects using the polymer vertical splitter are suitable for high-speed data transmission with multiple output ports.