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A new technique is proposed for measuring film structure based on the combination of time- and frequency-domain fitting and white-light scanning interferometry. The approach requires only single scanning and employs a fitting method to obtain the film thickness and the upper surface height in the frequency and time domains, respectively. The cross-correlation function is applied to obtain the initial value of the upper surface height, thereby making the fitting process more accurate. Standard films (SiO₂) with different thicknesses were measured to verify the accuracy and reliability of the proposed method, and the three-dimensional topographies of the upper and lower surfaces of the films were reconstructed.