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The interdiffusion behaviors of elements at the W/Co interface under the application of current during SPS were investigated. It is found that Co _7 W _6 and Co _3 W are formed at the W/Co bonding interface. The growth of the Co _3 W layer is apparently improved by the high current during SPS. The growth rate constant of the Co _3 W layer undercurrent is 1.73–3.03 times faster than that without current. The research shows that the growth rate is increased with the current density. The growth activation energy of the Co _3 W layer is calculated to be 229.51 ± 27 kJ mol ^−1 undercurrent, which is smaller than that without current (279.38 ± 11 kJ mol ^−1 ). Moreover, the growth activation energy of the Co _3 W layer is decreased with the increase of the current density. The mechanism of current-improved growth of the Co _3 W layer is suggested to be the fact that the current lowers the nucleation barrier of intermetallic layer, which accordingly promotes chemical reactions.