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Electroless noble metal deposition on the conducting substrate is widely used to obtain the desired film or coating on the substrate of interest. Wire-gauge-based Pt/Pd/Pt-Pd (individually, sequentially, and simultaneously deposited) catalysts have been developed using formaldehyde and sodium formate as reducing agents. Various surface pretreatment methods like SnCl₂ + PdCl₂ seeding, oxalic acid etching, and HCl activation (etching) have been employed to obtain the desired noble metal coating. Minimum time duration was observed for simultaneously deposited catalysts using formaldehyde as a reducing agent. Prepared catalysts were characterized for noble metal deposition, coating kinetics, surface morphology, and binding energy. The catalyst was found to be active for H₂ and O₂ recombination reactions for hydrogen mitigation applications in nuclear reactors.