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SiP(System-in-Package) is the latest microelectronic packaging and system integration technology, now it has become a hot spot in the development of electronic technology. The most distinctive feature of SiP is the use of 3D(Three Dimensions) technology in package. Through 3D technology, we can achieve higher system integration and package more chips in a smaller area. From the design point of view, this paper sets forth the 3D design technology applied in SiP, including 3D substrate design technology and 3D assembly design technology, and expounds the specific ideas and methods of 3D design, which can be used for reference by engineers in designing 3D SiP.