The Influence of Annealing Temperature on the Microstructure and Electrical Properties of Sputtered ZnO Thin Films

oleh: Adil Alshoaibi

Format: Article
Diterbitkan: MDPI AG 2024-08-01

Deskripsi

Thin films are the backbone of the electronics industry, and their widespread application in heat sensors, solar cells, and thin-film transistors has attracted the attention of researchers. The current study involves the deposition of a hetero-structured (ZnO/Zn/ZnO) thin film on a well-cleaned glass substrate using the DC magnetron sputtering technique. The samples were then annealed at 100, 200, 300, 400, and 500 °C. The structural, morphological, and electrical characteristics of the annealed samples as well as one as-deposited sample were then examined using atomic force microscopy (AFM), scanning electron microscopy (SEM), X-ray diffraction (XRD), and a Hall effect measuring apparatus. XRD analysis showed a hexagonal ZnO crystal structure for the samples annealed at 300 and 400 °C, whereas the samples annealed at 100 and 200 °C showed metallic zinc and hexagonal ZnO, and the crystallinity decreased for the sample annealed at 500 °C with pure hexagonal crystal symmetry. According to the AFM study, as the annealing temperature increases, the average roughness (R<sub>a</sub>) decreases. Temperature has an inverse relationship with particle size. The optimal annealing temperature was determined to be 400 °C. Over this temperature range, the average roughness and particle size increased. Similarly, when R<sub>a</sub> decreased, the conductivity increased and the resistance decreased. A fundamental difficulty is that the heating of the heterostructure to 400 °C melts the Zn-based intermediate layer, which alters the Zn phase and disrupts the sample homogeneity.