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A cost-efficient and practical strategy was developed for preparing high thermal conductive epoxy packaging composites. The effective conductive network was constructed by the bridging effect between boron nitride (BN) and spherical silica (SiO _2 ). Compared to the epoxy (EP) composites with randomly dispersed BN and SiO _2 , the EP/SiO _2 @BN showed a great enhancement in thermal conduction. The thermal conductivity of EP/SiO _2 @BN reached to 0.86 W m ^−1  K ^−1 with 60 wt% content of hybrid filler, which was 91% higher than that of EP/SiO _2 samples and was around 12% higher than that of epoxy composites with unmodified BN and SiO _2 . In addition, the EP/SiO _2 @BN exhibited lower thermal interface resistance in comparison with EP/SiO _2 &BN composites according to the effective medium theory (EMT). The encapsulation of BN on the surface of SiO _2 greatly enhanced the thermal transfer efficiency of the epoxy matrix and showed great potential in the epoxy packaging practical application.