Hasil Pencarian - Yuan-Fu Cheng

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  1. 1
    Enhanced Nanotwinned Copper Bonding through Epoxy-Induced Copper Surface Modification

    Enhanced Nanotwinned Copper Bonding through Epoxy-Induced Copper Surface Modification oleh Tsan-Feng Lu, Pei-Wen Wang, Yuan-Fu Cheng, Yu-Ting Yen, YewChung Sermon Wu

    Diterbitkan 2024-04-01
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  2. 2
    Enhancement of Abnormal Grain Growth by Surface Quenching Treatment to Eliminate Cu–Cu Bonding Interfaces Using (111)-Oriented Nanotwinned Copper

    Enhancement of Abnormal Grain Growth by Surface Quenching Treatment to Eliminate Cu–Cu Bonding Interfaces Using (111)-Oriented Nanotwinned Copper oleh Tsan-Feng Lu, Yu-Ting Yen, Yuan-Fu Cheng, Pei-Wen Wang, YewChung Sermon Wu

    Diterbitkan 2024-07-01
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  3. 3
    Eliminating Cu–Cu Bonding Interfaces Using Electroplated Copper and (111)-Oriented Nanotwinned Copper

    Eliminating Cu–Cu Bonding Interfaces Using Electroplated Copper and (111)-Oriented Nanotwinned Copper oleh Tsan-Feng Lu, Yuan-Fu Cheng, Pei-Wen Wang, Yu-Ting Yen, YewChung Sermon Wu

    Diterbitkan 2024-07-01
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  4. 4
    Enhanced Copper Bonding Interfaces by Quenching to Form Wrinkled Surfaces

    Enhanced Copper Bonding Interfaces by Quenching to Form Wrinkled Surfaces oleh Tsan-Feng Lu, Yu-Ting Yen, Pei-Wen Wang, Yuan-Fu Cheng, Cheng-Hsiang Chen, YewChung Sermon Wu

    Diterbitkan 2024-05-01
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