Hasil Pencarian - Wuqing Lin

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  1. 1
    Mueller Matrix Ellipsometric Characterization of Nanoscale Subsurface Damage of 4H-SiC Wafers: From Grinding to CMP

    Mueller Matrix Ellipsometric Characterization of Nanoscale Subsurface Damage of 4H-SiC Wafers: From Grinding to CMP oleh Huihui Li, Huihui Li, Changcai Cui, Changcai Cui, Jing Lu, Jing Lu, Zhongwei Hu, Zhongwei Hu, Wuqing Lin, Wuqing Lin, Wuqing Lin, Subiao Bian, Subiao Bian, Xipeng Xu, Xipeng Xu

    Diterbitkan 2022-02-01
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  2. 2
    Comparison of Vibration-Assisted Scratch Characteristics of SiC Polytypes (3C-, 4H- and 6H-SiC)

    Comparison of Vibration-Assisted Scratch Characteristics of SiC Polytypes (3C-, 4H- and 6H-SiC) oleh Wuqing Lin, Zhongwei Hu, Yue Chen, Yuqiang Zhang, Yiqing Yu, Xipeng Xu, Jie Zhang

    Diterbitkan 2022-04-01
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