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    Correlative, ML-based and non-destructive 3D-analysis of intergranular fatigue cracking in SAC305-Bi solder balls

    Correlative, ML-based and non-destructive 3D-analysis of intergranular fatigue cracking in SAC305-Bi solder balls oleh Charlotte Cui, Fereshteh Falah Chamasemani, Priya Paulachan, Rahulkumar Sinojiya, Jördis Rosc, Michael Reisinger, Peter Imrich, Walter Hartner, Roland Brunner

    Diterbitkan 2024-04-01
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