Hasil Pencarian - Tzu-Heng Hung

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  1. 1
    Stress Issue of Vertical Connections in 3D Integration for High-Bandwidth Memory Applications

    Stress Issue of Vertical Connections in 3D Integration for High-Bandwidth Memory Applications oleh Tzu-Heng Hung, Yu-Ming Pan, Kuan-Neng Chen

    Diterbitkan 2023-07-01
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  2. 2
    A Low-Cost Passivation for Low Temperature Cu-Cu Bonding Using PVD-Deposited Cu<sub>3</sub>N

    A Low-Cost Passivation for Low Temperature Cu-Cu Bonding Using PVD-Deposited Cu<sub>3</sub>N oleh Tzu-Heng Hung, Ping-Jung Liu, Chiao-Yen Wang, Tsai-Fu Chung, Kuan-Neng Chen

    Diterbitkan 2023-01-01
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  3. 3
    Cu-Based Thermocompression Bonding and Cu/Dielectric Hybrid Bonding for Three-Dimensional Integrated Circuits (3D ICs) Application

    Cu-Based Thermocompression Bonding and Cu/Dielectric Hybrid Bonding for Three-Dimensional Integrated Circuits (3D ICs) Application oleh Yuan-Chiu Huang, Yu-Xian Lin, Chien-Kang Hsiung, Tzu-Heng Hung, Kuan-Neng Chen

    Diterbitkan 2023-09-01
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