Hasil Pencarian - Songbai Xue

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  1. 1
    Effect of In and Pr on the Microstructure and Properties of Low-Silver Filler Metal

    Effect of In and Pr on the Microstructure and Properties of Low-Silver Filler Metal oleh Jie Wu, Songbai Xue, Peng Zhang

    Diterbitkan 2021-08-01
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  2. 2
    Development of a Novel Low-Silver Cu-P Brazing Filler Metal Bearing Sn

    Development of a Novel Low-Silver Cu-P Brazing Filler Metal Bearing Sn oleh Jie Wu, Songbai Xue, Qingcheng Luo

    Diterbitkan 2022-01-01
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  3. 3
    Influences of Sn on Properties of Ag-Based and Cu-Based Brazing Filler Metals

    Influences of Sn on Properties of Ag-Based and Cu-Based Brazing Filler Metals oleh Qingcheng Luo, Songbai Xue, Jie Wu

    Diterbitkan 2021-11-01
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  4. 4
    Comparative Study on the Activity of GaF<sub>3</sub> and Ga<sub>2</sub>O<sub>3</sub> Nanoparticle-Doped CsF-AlF<sub>3</sub> Flux for Brazing 6061 Al/Q235 Steel Joints

    Comparative Study on the Activity of GaF<sub>3</sub> and Ga<sub>2</sub>O<sub>3</sub> Nanoparticle-Doped CsF-AlF<sub>3</sub> Flux for Brazing 6061 Al/Q235 Steel Joints oleh Zhen Yao, Songbai Xue, Junxiong Zhang

    Diterbitkan 2020-06-01
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  5. 5
    Mechanical Property of Sn-58Bi Solder Paste Strengthened by Resin

    Mechanical Property of Sn-58Bi Solder Paste Strengthened by Resin oleh Lu Liu, Songbai Xue, Siyi Liu

    Diterbitkan 2018-10-01
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  6. 6
    Study on the Oscillating Phenomenon of Welding Pool with Different Penetration States in Short-Circuiting GMAW

    Study on the Oscillating Phenomenon of Welding Pool with Different Penetration States in Short-Circuiting GMAW oleh Haoxuan Qian, Tao Chen, Songbai Xue

    Diterbitkan 2023-05-01
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  7. 7
    New challenges of miniaturization of electronic devices: Electromigration and thermomigration in lead-free solder joints

    New challenges of miniaturization of electronic devices: Electromigration and thermomigration in lead-free solder joints oleh Peng Zhang, Songbai Xue, Jianhao Wang

    Diterbitkan 2020-07-01
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  8. 8
    Effect of Various Nanoparticles (GaF<sub>3</sub>, ZnF<sub>2</sub>, Zn(BF<sub>4</sub>)<sub>2</sub> and Ga<sub>2</sub>O<sub>3</sub>) Additions on the Activity of CsF-RbF-AlF<sub>3</sub> Flux and Mechanical Behavior of Al/Steel Brazed Joints

    Effect of Various Nanoparticles (GaF<sub>3</sub>, ZnF<sub>2</sub>, Zn(BF<sub>4</sub>)<sub>2</sub> and Ga<sub>2</sub>O<sub>3</sub>) Additions on the Activity of CsF-RbF-AlF<sub>3</s... oleh Zhen Yao, Songbai Xue, Junxiong Zhang

    Diterbitkan 2020-08-01
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  9. 9
    Novel Au-Based Solder Alloys: A Potential Answer for Electrical Packaging Problem

    Novel Au-Based Solder Alloys: A Potential Answer for Electrical Packaging Problem oleh Jiachen Xu, Mingfang Wu, Juan Pu, Songbai Xue

    Diterbitkan 2020-01-01
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  10. 10
    Study on Microstructure and Properties of 12Ag–Cu–Zn–Sn Cadmium-Free Filler Metals with Trace In Addition

    Study on Microstructure and Properties of 12Ag–Cu–Zn–Sn Cadmium-Free Filler Metals with Trace In Addition oleh Jie Wu, Songbai Xue, Zhen Yao, Weimin Long

    Diterbitkan 2021-05-01
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  11. 11
    Inducing the Effect of a Ga<sub>2</sub>O<sub>3</sub> Nano-Particle on the CsF-RbF-AlF<sub>3</sub> Flux for Brazing Aluminum to Carbon Steels

    Inducing the Effect of a Ga<sub>2</sub>O<sub>3</sub> Nano-Particle on the CsF-RbF-AlF<sub>3</sub> Flux for Brazing Aluminum to Carbon Steels oleh Zhen Yao, Songbai Xue, Jinlong Yang, Junxiong Zhang

    Diterbitkan 2020-03-01
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  12. 12
    Board Level Drop Test for Evaluating the Reliability of High-Strength Sn–Bi Composite Solder Pastes with Thermosetting Epoxy

    Board Level Drop Test for Evaluating the Reliability of High-Strength Sn–Bi Composite Solder Pastes with Thermosetting Epoxy oleh Lu Liu, Songbai Xue, Ruiyang Ni, Peng Zhang

    Diterbitkan 2022-06-01
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  13. 13
    Effect of 0.05 wt.% Pr Addition on Microstructure and Shear Strength of Sn-0.3Ag-0.7Cu/Cu Solder Joint during the Thermal Aging Process

    Effect of 0.05 wt.% Pr Addition on Microstructure and Shear Strength of Sn-0.3Ag-0.7Cu/Cu Solder Joint during the Thermal Aging Process oleh Jie Wu, Songbai Xue, Jingwen Wang, Guoqiang Huang

    Diterbitkan 2019-09-01
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  14. 14
    Study on the Reliability of Sn–Bi Composite Solder Pastes with Thermosetting Epoxy under Thermal Cycling and Humidity Treatment

    Study on the Reliability of Sn–Bi Composite Solder Pastes with Thermosetting Epoxy under Thermal Cycling and Humidity Treatment oleh Lu Liu, Songbai Xue, Ruiyang Ni, Peng Zhang, Jie Wu

    Diterbitkan 2021-06-01
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  15. 15
    Influence of Ga Content on the Microstructure and Mechanical Properties of Cadmium-Free Filler Metal

    Influence of Ga Content on the Microstructure and Mechanical Properties of Cadmium-Free Filler Metal oleh Jie Wu, Songbai Xue, Lu Liu, Peng Zhang, Qingcheng Luo

    Diterbitkan 2022-07-01
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  16. 16
    Effect of Cr Addition on Microstructure and Properties of AuGa Solder

    Effect of Cr Addition on Microstructure and Properties of AuGa Solder oleh Yu Tao, Songbai Xue, Han Liu, Weimin Long, Bo Wang

    Diterbitkan 2020-10-01
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  17. 17
    Study on the Reliability of Sn50Pb49Sb1/Cu Solder Joints Subjected to γ-ray Irradiation

    Study on the Reliability of Sn50Pb49Sb1/Cu Solder Joints Subjected to γ-ray Irradiation oleh Jianhao Wang, Songbai Xue, Zhaoping Lv, Li Wen, Siyi Liu

    Diterbitkan 2018-09-01
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  18. 18
    Effects of Porosity, Heat Input and Post-Weld Heat Treatment on the Microstructure and Mechanical Properties of TIG Welded Joints of AA6082-T6

    Effects of Porosity, Heat Input and Post-Weld Heat Treatment on the Microstructure and Mechanical Properties of TIG Welded Joints of AA6082-T6 oleh Bo Wang, Songbai Xue, Chaoli Ma, Jianxin Wang, Zhongqiang Lin

    Diterbitkan 2017-11-01
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  19. 19
    Effects of Trace Oxygen Content on Microstructure and Performances of Au-20Sn/Cu Solder Joints

    Effects of Trace Oxygen Content on Microstructure and Performances of Au-20Sn/Cu Solder Joints oleh Yang Li, Di Wu, Yabin Zhang, Liujue Wang, Songbai Xue

    Diterbitkan 2021-05-01
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  20. 20
    Study in Wire Feedability-Related Properties of Al-5Mg Solid Wire Electrodes Bearing Zr for High-Speed Train

    Study in Wire Feedability-Related Properties of Al-5Mg Solid Wire Electrodes Bearing Zr for High-Speed Train oleh Bo Wang, Songbai Xue, Chaoli Ma, Jianxin Wang, Zhongqiang Lin

    Diterbitkan 2017-11-01
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