Hasil Pencarian - Shih-Chi Yang
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1
Effect of bonding interfacial microstructures on the properties and reliabilities of Cu–Cu joints oleh Shih-Chi Yang, Jia-Juen Ong, Chih Chen
Diterbitkan 2024-09-01
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2
Recrystallization and Grain Growth in Cu-Cu Joints under Electromigration at Low Temperatures oleh Shih-Chi Yang, Dinh-Phuc Tran, Chih Chen
Diterbitkan 2023-08-01
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3
Electromigration in Cu–Cu joints: Measurement of activation energy and polarity effect oleh Shih-Chi Yang, Yu-Tao Yang, Chih Chen
Diterbitkan 2024-11-01
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Engineering Bilayer AlOx /YAlOx Dielectric Stacks for Hysteresis-Free Switching in Solution-Processed Metal-Oxide Thin-Film Transistors oleh Sami Bolat, Evangelos Agiannis, Shih-Chi Yang, Moritz H. Futscher, Abdesselam Aribia, Ivan Shorubalko, Yaroslav E. Romanyuk
Diterbitkan 2022-01-01
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To suppress thermomigration of Cu–Sn intermetallic compounds in flip-chip solder joints oleh Yan-Rong Huang, Dinh-Phuc Tran, Po-Ning Hsu, Shih-Chi Yang, A.M. Gusak, K.N. Tu, Chih Chen
Diterbitkan 2023-05-01
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8
Measurement of Thermal Stress by X-ray Nano-Diffraction in (111)-Oriented Nanotwinned Cu Bumps for Cu/SiO<sub>2</sub> Hybrid Joints oleh Wei-You Hsu, Shih-Chi Yang, You-Yi Lin, Wan-Zhen Hsieh, King-Ning Tu, Wei-Lan Chiu, Hsiang-Hung Chang, Ching-Yu Chiang, Chih Chen
Diterbitkan 2023-08-01
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9
Low-Temperature Cu/SiO<sub>2</sub> Hybrid Bonding with Low Contact Resistance Using (111)-Oriented Cu Surfaces oleh Jia-Juen Ong, Wei-Lan Chiu, Ou-Hsiang Lee, Chia-Wen Chiang, Hsiang-Hung Chang, Chin-Hung Wang, Kai-Cheng Shie, Shih-Chi Yang, Dinh-Phuc Tran, King-Ning Tu, Chih Chen
Diterbitkan 2022-03-01
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