Hasil Pencarian - Shih-Chi Yang

  • Menampilkan 1 - 9 hasil dari 9
Perbaiki Hasil
  1. 1
    Effect of bonding interfacial microstructures on the properties and reliabilities of Cu–Cu joints

    Effect of bonding interfacial microstructures on the properties and reliabilities of Cu–Cu joints oleh Shih-Chi Yang, Jia-Juen Ong, Chih Chen

    Diterbitkan 2024-09-01
    Dapatkan teks lengkap
    Artikel
    Simpan ke Daftar
    Disimpan di:
  2. 2
    Recrystallization and Grain Growth in Cu-Cu Joints under Electromigration at Low Temperatures

    Recrystallization and Grain Growth in Cu-Cu Joints under Electromigration at Low Temperatures oleh Shih-Chi Yang, Dinh-Phuc Tran, Chih Chen

    Diterbitkan 2023-08-01
    Dapatkan teks lengkap
    Artikel
    Simpan ke Daftar
    Disimpan di:
  3. 3
    Electromigration in Cu–Cu joints: Measurement of activation energy and polarity effect

    Electromigration in Cu–Cu joints: Measurement of activation energy and polarity effect oleh Shih-Chi Yang, Yu-Tao Yang, Chih Chen

    Diterbitkan 2024-11-01
    Dapatkan teks lengkap
    Artikel
    Simpan ke Daftar
    Disimpan di:
  4. 4
    Shearing Characteristics of Cu-Cu Joints Fabricated by Two-Step Process Using Highly <111>-Oriented Nanotwinned Cu

    Shearing Characteristics of Cu-Cu Joints Fabricated by Two-Step Process Using Highly <111>-Oriented Nanotwinned Cu oleh Jia-Juen Ong, Dinh-Phuc Tran, Shih-Chi Yang, Kai-Cheng Shie, Chih Chen

    Diterbitkan 2021-11-01
    Dapatkan teks lengkap
    Artikel
    Simpan ke Daftar
    Disimpan di:
  5. 5
    Engineering Bilayer AlOx /YAlOx Dielectric Stacks for Hysteresis-Free Switching in Solution-Processed Metal-Oxide Thin-Film Transistors

    Engineering Bilayer AlOx /YAlOx Dielectric Stacks for Hysteresis-Free Switching in Solution-Processed Metal-Oxide Thin-Film Transistors oleh Sami Bolat, Evangelos Agiannis, Shih-Chi Yang, Moritz H. Futscher, Abdesselam Aribia, Ivan Shorubalko, Yaroslav E. Romanyuk

    Diterbitkan 2022-01-01
    Dapatkan teks lengkap
    Artikel
    Simpan ke Daftar
    Disimpan di:
  6. 6
    Stress Relaxation and Grain Growth Behaviors of (111)-Preferred Nanotwinned Copper during Annealing

    Stress Relaxation and Grain Growth Behaviors of (111)-Preferred Nanotwinned Copper during Annealing oleh Jyun-Yu Lai, Dinh-Phuc Tran, Shih-Chi Yang, I-Hsin Tseng, Kai-Cheng Shie, Jihperng Leu, Chih Chen

    Diterbitkan 2023-02-01
    Dapatkan teks lengkap
    Artikel
    Simpan ke Daftar
    Disimpan di:
  7. 7
    To suppress thermomigration of Cu–Sn intermetallic compounds in flip-chip solder joints

    To suppress thermomigration of Cu–Sn intermetallic compounds in flip-chip solder joints oleh Yan-Rong Huang, Dinh-Phuc Tran, Po-Ning Hsu, Shih-Chi Yang, A.M. Gusak, K.N. Tu, Chih Chen

    Diterbitkan 2023-05-01
    Dapatkan teks lengkap
    Artikel
    Simpan ke Daftar
    Disimpan di:
  8. 8
    Measurement of Thermal Stress by X-ray Nano-Diffraction in (111)-Oriented Nanotwinned Cu Bumps for Cu/SiO<sub>2</sub> Hybrid Joints

    Measurement of Thermal Stress by X-ray Nano-Diffraction in (111)-Oriented Nanotwinned Cu Bumps for Cu/SiO<sub>2</sub> Hybrid Joints oleh Wei-You Hsu, Shih-Chi Yang, You-Yi Lin, Wan-Zhen Hsieh, King-Ning Tu, Wei-Lan Chiu, Hsiang-Hung Chang, Ching-Yu Chiang, Chih Chen

    Diterbitkan 2023-08-01
    Dapatkan teks lengkap
    Artikel
    Simpan ke Daftar
    Disimpan di:
  9. 9
    Low-Temperature Cu/SiO<sub>2</sub> Hybrid Bonding with Low Contact Resistance Using (111)-Oriented Cu Surfaces

    Low-Temperature Cu/SiO<sub>2</sub> Hybrid Bonding with Low Contact Resistance Using (111)-Oriented Cu Surfaces oleh Jia-Juen Ong, Wei-Lan Chiu, Ou-Hsiang Lee, Chia-Wen Chiang, Hsiang-Hung Chang, Chin-Hung Wang, Kai-Cheng Shie, Shih-Chi Yang, Dinh-Phuc Tran, King-Ning Tu, Chih Chen

    Diterbitkan 2022-03-01
    Dapatkan teks lengkap
    Artikel
    Simpan ke Daftar
    Disimpan di:

Alat Pencarian: