Hasil Pencarian - Sen Cong

  • Menampilkan 1 - 4 hasil dari 4
Perbaiki Hasil
  1. 1
    Reliability and prediction of Sn36Pb2Ag solder joints under thermal aging test

    Reliability and prediction of Sn36Pb2Ag solder joints under thermal aging test oleh Sen Cong, Peng Liu, Shaobin Wang, Jinghua Xiong

    Diterbitkan 2023-01-01
    Dapatkan teks lengkap
    Artikel
    Simpan ke Daftar
    Disimpan di:
  2. 2
    Interface evolution and mechanical properties of Sn–36Pb–2Ag solder joints under different aging conditions

    Interface evolution and mechanical properties of Sn–36Pb–2Ag solder joints under different aging conditions oleh Rui Li, Sen Cong, Jiancheng Mei, Le Zhang, Zhuo Chen, Ting Li, Xinjian Yuan

    Diterbitkan 2021-01-01
    Dapatkan teks lengkap
    Artikel
    Simpan ke Daftar
    Disimpan di:
  3. 3
    Long-term storage life prediction and growth kinetics of intermetallic compounds in 62Sn36Pb2Ag solder joints

    Long-term storage life prediction and growth kinetics of intermetallic compounds in 62Sn36Pb2Ag solder joints oleh He ZHANG, Jia-yun FENG, Sen CONG, Shang WANG, Rong AN, Lang WU, Yan-hong TIAN

    Diterbitkan 2023-03-01
    Dapatkan teks lengkap
    Artikel
    Simpan ke Daftar
    Disimpan di:
  4. 4
    Growth kinetics of (CuxNi1-x)6Sn5 intermetallic compound at the interface of mixed Sn63Pb37/SAC305 BGA solder joints during thermal aging test

    Growth kinetics of (CuxNi1-x)6Sn5 intermetallic compound at the interface of mixed Sn63Pb37/SAC305 BGA solder joints during thermal aging test oleh Sen Cong, Weiwei Zhang, He Zhang, Peng Liu, Xingwen Tan, Lang Wu, Rong An, Yanhong Tian

    Diterbitkan 2021-01-01
    Dapatkan teks lengkap
    Artikel
    Simpan ke Daftar
    Disimpan di:

Alat Pencarian: