Hasil Pencarian - Po-Yu Kung

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  1. 1
    Highly Robust Ti Adhesion Layer during Terminal Reaction in Micro-Bumps

    Highly Robust Ti Adhesion Layer during Terminal Reaction in Micro-Bumps oleh Chen-Wei Kao, Po-Yu Kung, Chih-Chia Chang, Wei-Chen Huang, Fu-Ling Chang, C. R. Kao

    Diterbitkan 2022-06-01
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  2. 2
    Investigation of Low-Pressure Sn-Passivated Cu-to-Cu Direct Bonding in 3D-Integration

    Investigation of Low-Pressure Sn-Passivated Cu-to-Cu Direct Bonding in 3D-Integration oleh Po-Yu Kung, Wei-Lun Huang, Chin-Li Kao, Yung-Sheng Lin, Yun-Ching Hung, C. R. Kao

    Diterbitkan 2022-11-01
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