Hasil Pencarian - Luobin Zhang

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  1. 1
    Synthesis and Atomic Transport of CoSn3 NanoIMC by In Situ TEM

    Synthesis and Atomic Transport of CoSn3 NanoIMC by In Situ TEM oleh Jintao Wang, Jianqiang Wang, Luobin Zhang, Ziwen Lv, Hongtao Chen, Mingyu Li

    Diterbitkan 2023-08-01
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  2. 2
    CoSn<sub>3</sub> Intermetallic Nanoparticles for Electronic Packaging

    CoSn<sub>3</sub> Intermetallic Nanoparticles for Electronic Packaging oleh Jintao Wang, Ziwen Lv, Luobin Zhang, Fangcheng Duan, Weiwei Zhang, Hongtao Chen

    Diterbitkan 2022-11-01
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  3. 3
    Malignant mediastinal mesothelioma treated with anlotinib: a case report and review of the literature

    Malignant mediastinal mesothelioma treated with anlotinib: a case report and review of the literature oleh Yishi Zhang, Wan He, Ke Zhan, Luobin Zhang, Hua Cao, Ruilian Xu

    Diterbitkan 2023-05-01
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  4. 4
    A Study of Electroplated Nanoporous Copper Using Aberration-Corrected Transmission Electron Microscopy

    A Study of Electroplated Nanoporous Copper Using Aberration-Corrected Transmission Electron Microscopy oleh Jianqiang Wang, Jintao Wang, Ziwen Lv, Luobin Zhang, Fengyi Wang, Hongtao Chen, Mingyu Li

    Diterbitkan 2024-03-01
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  5. 5
    Effect of CoSn3 nanocrystals on Sn3Ag plating for electronic packaging

    Effect of CoSn3 nanocrystals on Sn3Ag plating for electronic packaging oleh Jintao Wang, Luobin Zhang, ZiWen Lv, Jianqiang Wang, Weiwei Zhang, Xinjie Wang, Hongtao Chen, Mingyu Li

    Diterbitkan 2023-11-01
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  6. 6
    An innovative high-entropy alloy solder for high-reliability low-temperature bonding in 3D electronic packaging–based on nano InSnBiZnAg particles

    An innovative high-entropy alloy solder for high-reliability low-temperature bonding in 3D electronic packaging–based on nano InSnBiZnAg particles oleh Yini Chen, Jintao Wang, Ziwen Lv, Jianqiang Wang, Feng Tian, Luobin Zhang, Weiwei Zhang, Hongtao Chen, Mingyu Li

    Diterbitkan 2024-05-01
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  7. 7
    A Multilayer Paste Based on Ag Nanoparticles with Cu@Sn for Die Attachment in Power Device Packaging

    A Multilayer Paste Based on Ag Nanoparticles with Cu@Sn for Die Attachment in Power Device Packaging oleh Jintao Wang, Xinjie Wang, Lin Zhang, Luobin Zhang, Fangcheng Duan, Fengyi Wang, Weiwei Zhang, Jianqiang Wang, Zheng Zhang, Chunjin Hang, Hongtao Chen

    Diterbitkan 2022-01-01
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  8. 8
    Effect of melt hydrogenation on microstructure evolution and tensile properties of (TiB + TiC)/Ti-6Al-4V composites

    Effect of melt hydrogenation on microstructure evolution and tensile properties of (TiB + TiC)/Ti-6Al-4V composites oleh Liang Wang, Luobin Zhang, LiangShun Luo, Binbin Wang, Hui Yan, RuiRun Chen, YanQing Su, JingJie Guo, HengZhi Fu

    Diterbitkan 2020-05-01
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