Hasil Pencarian - Lipeng Tan

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  1. 1
    Development of LED Package Heat Dissipation Research

    Development of LED Package Heat Dissipation Research oleh Peisheng Liu, Chenhui She, Lipeng Tan, Pengpeng Xu, Lei Yan

    Diterbitkan 2022-01-01
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  2. 2
    Reliability Analysis of Flip-Chip Packaging GaN Chip with Nano-Silver Solder BUMP

    Reliability Analysis of Flip-Chip Packaging GaN Chip with Nano-Silver Solder BUMP oleh Lei Yan, Peisheng Liu, Pengpeng Xu, Lipeng Tan, Zhao Zhang

    Diterbitkan 2023-06-01
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  3. 3
    Stress warpage analysis of IGBT module package reflow soldering

    Stress warpage analysis of IGBT module package reflow soldering oleh Lipeng TAN, Chenhui SHE, Peisheng LIU, Pengpeng XU, Yujuan TAO

    Diterbitkan 2021-06-01
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  4. 4
    Research on Heat Dissipation of Multi-Chip LED Filament Package

    Research on Heat Dissipation of Multi-Chip LED Filament Package oleh Lipeng Tan, Peisheng Liu, Chenhui She, Pengpeng Xu, Lei Yan, Hui Quan

    Diterbitkan 2021-12-01
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  5. 5
    Heat Dissipation Characteristics of IGBT Module Based on Flow-Solid Coupling

    Heat Dissipation Characteristics of IGBT Module Based on Flow-Solid Coupling oleh Lipeng Tan, Peisheng Liu, Chenhui She, Pengpeng Xu, Lei Yan, Hui Quan

    Diterbitkan 2022-03-01
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