Hasil Pencarian - Kyung-Wook Paik

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  1. 1
    Crack mechanism correlated with Sn grain orientations on Ni metal surface subjected to 1000 thermal shocks

    Crack mechanism correlated with Sn grain orientations on Ni metal surface subjected to 1000 thermal shocks oleh Xinyi Jing, Keyu Luo, Kyung-Wook Paik, Peng He, Shuye Zhang

    Diterbitkan 2023-09-01
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  2. 2
    Editorial: Composite solder joints

    Editorial: Composite solder joints oleh Shuye Zhang, Peng He, Kyung-Wook Paik, Ephraim Suhir, Ning-Cheng Lee

    Diterbitkan 2022-11-01
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  3. 3
    The grain refinements effect of Zn alloying on low-temperature Sn–Bi–In lead-free solder

    The grain refinements effect of Zn alloying on low-temperature Sn–Bi–In lead-free solder oleh Sunwu Xu, Yifei Li, Xinyi Jing, Kyung-Wook Paik, Peng He, Shuye Zhang

    Diterbitkan 2024-03-01
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  4. 4
    A Study on Transmission properties of AuNi coated polymer ball joint and Sn58Bi solder joint for flex-on-board interconnection

    A Study on Transmission properties of AuNi coated polymer ball joint and Sn58Bi solder joint for flex-on-board interconnection oleh Shuye Zhang, Junyong Park, Gapyeol Park, Huijin Song, Joungho Kim, Kyung-Wook Paik, Peng He

    Diterbitkan 2022-06-01
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  5. 5
    Challenges and recent prospectives of 3D heterogeneous integration

    Challenges and recent prospectives of 3D heterogeneous integration oleh Shuye Zhang, Zhenfeng Li, Hongzhi Zhou, Rongqing Li, Shaoan Wang, Kyung-Wook Paik, Peng He

    Diterbitkan 2022-01-01
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  6. 6
    The doped Pd on the crystal calculation and intermetallic property of low-temperature soldered ENEPIG substrates

    The doped Pd on the crystal calculation and intermetallic property of low-temperature soldered ENEPIG substrates oleh Shuye Zhang, Shaoan Wang, Shang Zhang, Xiangyu Chen, Chen Zeng, Kyung-Wook Paik, Peng He

    Diterbitkan 2023-11-01
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  7. 7
    Shear performance and accelerated reliability of solder interconnects for fan-out wafer-level package

    Shear performance and accelerated reliability of solder interconnects for fan-out wafer-level package oleh Shuye Zhang, Ran Duan, Sunwu Xu, Panfei Xue, Chengqian Wang, Jieshi Chen, Kyung-Wook Paik, Peng He

    Diterbitkan 2022-06-01
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  8. 8
    Effect of microwave hybrid susceptors on the interface morphology, mechanical properties and fracture morphology of Cu/nano-Sn-3.0Ag-0.5Cu/Cu joints

    Effect of microwave hybrid susceptors on the interface morphology, mechanical properties and fracture morphology of Cu/nano-Sn-3.0Ag-0.5Cu/Cu joints oleh Shuai Zhang, Hongzhi Zhou, Tianran Ding, Weimin Long, Sujuan Zhong, Kyung-Wook Paik, Peng He, Shuye Zhang

    Diterbitkan 2024-01-01
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  9. 9
    The design of low-temperature solder alloys and the comparison of mechanical performance of solder joints on ENIG and ENEPIG interface

    The design of low-temperature solder alloys and the comparison of mechanical performance of solder joints on ENIG and ENEPIG interface oleh Shaoan Wang, Xiangyu Chen, Keyu Luo, Hongzhi Zhou, Rongqing Li, Peng He, Kyung-Wook Paik, Shuye Zhang

    Diterbitkan 2023-11-01
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  10. 10
    Mechanism of Solder Joint Cracks in Anisotropic Conductive Films Bonding and Solutions: Delaying Hot-Bar Lift-Up Time and Adding Silica Fillers

    Mechanism of Solder Joint Cracks in Anisotropic Conductive Films Bonding and Solutions: Delaying Hot-Bar Lift-Up Time and Adding Silica Fillers oleh Shuye Zhang, Ming Yang, Mingliang Jin, Wen-Can Huang, Tiesong Lin, Peng He, Panpan Lin, Kyung-Wook Paik

    Diterbitkan 2018-01-01
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  11. 11
    FPCB as an Acoustic Matching Layer for 1D Linear Ultrasound Transducer Arrays

    FPCB as an Acoustic Matching Layer for 1D Linear Ultrasound Transducer Arrays oleh Taemin Lee, Joontaek Jung, Sang-Mok Lee, Jongcheol Park, Jae-Hyeong Park, Kyung-Wook Paik, Hyunjoo J. Lee

    Diterbitkan 2022-07-01
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  12. 12
    IMCs Microstructure Evolution Dependence of Mechanical Properties for Ni/Sn/Ni Micro Solder-Joints

    IMCs Microstructure Evolution Dependence of Mechanical Properties for Ni/Sn/Ni Micro Solder-Joints oleh Ning Ren, Heng Fang, Dong Wang, Chenyi Hou, Yatao Zhao, Fan Chen, Ye Tian, Kyung-Wook Paik, Yiping Wu

    Diterbitkan 2020-01-01
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