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    Evaluation of the thermal conductance of flip-chip bonding structure utilizing the measurement based on Fourier’s law of heat conduction at steady-state

    Evaluation of the thermal conductance of flip-chip bonding structure utilizing the measurement based on Fourier’s law of heat conduction at steady-state oleh Chia-Yu Wu, Yin-Hsien Huang, Hsin-Han Wu, Tsung-Eong Hsieh

    Diterbitkan 2018-06-01
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