Hasil Pencarian - How Yuan Hwang

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  1. 1
    Photonic Packaging: Transforming Silicon Photonic Integrated Circuits into Photonic Devices

    Photonic Packaging: Transforming Silicon Photonic Integrated Circuits into Photonic Devices oleh Lee Carroll, Jun-Su Lee, Carmelo Scarcella, Kamil Gradkowski, Matthieu Duperron, Huihui Lu, Yan Zhao, Cormac Eason, Padraic Morrissey, Marc Rensing, Sean Collins, How Yuan Hwang, Peter O’Brien

    Diterbitkan 2016-12-01
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  2. 2
    Flip Chip Packaging of Digital Silicon Photonics MEMS Switch for Cloud Computing and Data Centre

    Flip Chip Packaging of Digital Silicon Photonics MEMS Switch for Cloud Computing and Data Centre oleh How Yuan Hwang, Jun Su Lee, Tae Joon Seok, Alex Forencich, Hannah R. Grant, Dylan Knutson, Niels Quack, Sangyoon Han, Richard S. Muller, George C. Papen, Ming C. Wu, Peter O'Brien

    Diterbitkan 2017-01-01
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