Hasil Pencarian - Houya Wu

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  1. 1
    Fast Filling of Microvia by Pre-Settling Particles and Following Cu Electroplating

    Fast Filling of Microvia by Pre-Settling Particles and Following Cu Electroplating oleh Ganglong Li, Zhiyi Li, Junjie Li, Houya Wu

    Diterbitkan 2022-05-01
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  2. 2
    Diffusion behavior of Cu/Ta heterogeneous interface under high temperature and high strain: An atomistic investigation

    Diffusion behavior of Cu/Ta heterogeneous interface under high temperature and high strain: An atomistic investigation oleh Ganglong Li, Houya Wu, Honglong Luo, Zhuo Chen, Andrew A. O. Tay, Wenhui Zhu

    Diterbitkan 2017-09-01
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