Hasil Pencarian - Guicui Fu

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  1. 1
    Research on a Defects Detection Method in the Ferrite Phase Shifter Cementing Process Based on a Multi-Sensor Prognostic and Health Management (PHM) System

    Research on a Defects Detection Method in the Ferrite Phase Shifter Cementing Process Based on a Multi-Sensor Prognostic and Health Management (PHM) System oleh Bo Wan, Guicui Fu, Yanruoyue Li, Youhu Zhao

    Diterbitkan 2016-08-01
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  2. 2
    Reliability Evaluation of Multi-Mechanism Failure for Semiconductor Devices Using Physics-of-Failure Technique and Maximum Entropy Principle

    Reliability Evaluation of Multi-Mechanism Failure for Semiconductor Devices Using Physics-of-Failure Technique and Maximum Entropy Principle oleh Bo Wan, Ye Wang, Yutai Su, Guicui Fu

    Diterbitkan 2020-01-01
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  3. 3
    Reconstruction of Pressureless Sintered Micron Silver Joints and Simulation Analysis of Elasticity Degradation in Deep Space Environment

    Reconstruction of Pressureless Sintered Micron Silver Joints and Simulation Analysis of Elasticity Degradation in Deep Space Environment oleh Wendi Guo, Guicui Fu, Bo Wan, Ming Zhu

    Diterbitkan 2020-09-01
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  4. 4
    A Novel RLS-KS Method for Parameter Estimation in Particle Filtering-Based Fatigue Crack Growth Prognostics

    A Novel RLS-KS Method for Parameter Estimation in Particle Filtering-Based Fatigue Crack Growth Prognostics oleh Xiaopeng Liu, Weifang Zhang, Xuerong Liu, Wei Dai, Guicui Fu

    Diterbitkan 2019-01-01
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  5. 5
    Quantitative Analysis of Weld-Pore Size and Depth and Effect on Fatigue Life of Ti-6Al-2Zr-1Mo-1V Alloy Weldments

    Quantitative Analysis of Weld-Pore Size and Depth and Effect on Fatigue Life of Ti-6Al-2Zr-1Mo-1V Alloy Weldments oleh Weifang Zhang, Xiaopeng Liu, Hongxun Wang, Wei Dai, Guicui Fu

    Diterbitkan 2017-10-01
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  6. 6
    Research on IGBT Bonding Wires Crack Propagation at the Macro and Micro Scales

    Research on IGBT Bonding Wires Crack Propagation at the Macro and Micro Scales oleh Jun Luo, Shukai Guan, Bo Wan, Maogong Jiang, Guicui Fu

    Diterbitkan 2021-01-01
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  7. 7
    Failure Analysis of SAC305 Ball Grid Array Solder Joint at Extremely Cryogenic Temperature

    Failure Analysis of SAC305 Ball Grid Array Solder Joint at Extremely Cryogenic Temperature oleh Yanruoyue Li, Guicui Fu, Bo Wan, Maogong Jiang, Weifang Zhang, Xiaojun Yan

    Diterbitkan 2020-03-01
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