Hasil Pencarian - Ganglong Li

  • Menampilkan 1 - 4 hasil dari 4
Perbaiki Hasil
  1. 1
    Fast Filling of Microvia by Pre-Settling Particles and Following Cu Electroplating

    Fast Filling of Microvia by Pre-Settling Particles and Following Cu Electroplating oleh Ganglong Li, Zhiyi Li, Junjie Li, Houya Wu

    Diterbitkan 2022-05-01
    Dapatkan teks lengkap
    Artikel
    Simpan ke Daftar
    Disimpan di:
  2. 2
    Microscale fracture toughness degradation of notched solder microcantilevers under varied accelerated aging process

    Microscale fracture toughness degradation of notched solder microcantilevers under varied accelerated aging process oleh Yidian Shi, Ganglong Li, Cheng Peng, Wenhui Zhu, Hu He

    Diterbitkan 2023-01-01
    Dapatkan teks lengkap
    Artikel
    Simpan ke Daftar
    Disimpan di:
  3. 3
    An Investigation on the Most Likely Failure Locations in the BEoL Stack of a 20 nm Chip Due to Chip Package Interaction with the Use of Novel Semi-Elliptical Cracks

    An Investigation on the Most Likely Failure Locations in the BEoL Stack of a 20 nm Chip Due to Chip Package Interaction with the Use of Novel Semi-Elliptical Cracks oleh Ganglong Li, Yidian Shi, Andrew A. O. Tay, Zhilin Long

    Diterbitkan 2023-10-01
    Dapatkan teks lengkap
    Artikel
    Simpan ke Daftar
    Disimpan di:
  4. 4
    Diffusion behavior of Cu/Ta heterogeneous interface under high temperature and high strain: An atomistic investigation

    Diffusion behavior of Cu/Ta heterogeneous interface under high temperature and high strain: An atomistic investigation oleh Ganglong Li, Houya Wu, Honglong Luo, Zhuo Chen, Andrew A. O. Tay, Wenhui Zhu

    Diterbitkan 2017-09-01
    Dapatkan teks lengkap
    Artikel
    Simpan ke Daftar
    Disimpan di:

Alat Pencarian: