Hasil Pencarian - Fangcheng Duan

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  1. 1
    Cu3Sn joint based on transient liquid phase bonding of Cu@Cu6Sn5 core–shell particles

    Cu3Sn joint based on transient liquid phase bonding of Cu@Cu6Sn5 core–shell particles oleh Jintao Wang, Jianqiang Wang, Fangcheng Duan, Hongtao Chen

    Diterbitkan 2023-01-01
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  2. 2
    CoSn<sub>3</sub> Intermetallic Nanoparticles for Electronic Packaging

    CoSn<sub>3</sub> Intermetallic Nanoparticles for Electronic Packaging oleh Jintao Wang, Ziwen Lv, Luobin Zhang, Fangcheng Duan, Weiwei Zhang, Hongtao Chen

    Diterbitkan 2022-11-01
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  3. 3
    A Short Review of Through-Silicon via (TSV) Interconnects: Metrology and Analysis

    A Short Review of Through-Silicon via (TSV) Interconnects: Metrology and Analysis oleh Jintao Wang, Fangcheng Duan, Ziwen Lv, Si Chen, Xiaofeng Yang, Hongtao Chen, Jiahao Liu

    Diterbitkan 2023-07-01
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  4. 4
    Die-attach bonding at 230 °C using micron Sn-coated Zn particles for high-temperature applications

    Die-attach bonding at 230 °C using micron Sn-coated Zn particles for high-temperature applications oleh Fengyi Wang, Xinjie Wang, Xingchao Mao, Fangcheng Duan, Chunjin Hang, Hongtao Chen, Mingyu Li

    Diterbitkan 2022-11-01
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  5. 5
    A Multilayer Paste Based on Ag Nanoparticles with Cu@Sn for Die Attachment in Power Device Packaging

    A Multilayer Paste Based on Ag Nanoparticles with Cu@Sn for Die Attachment in Power Device Packaging oleh Jintao Wang, Xinjie Wang, Lin Zhang, Luobin Zhang, Fangcheng Duan, Fengyi Wang, Weiwei Zhang, Jianqiang Wang, Zheng Zhang, Chunjin Hang, Hongtao Chen

    Diterbitkan 2022-01-01
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