Study on Delamination Between Polymer Materials and Metals in IC Packaging Process oleh Cheng-Tang Pan, Shao-Yu Wang, Chung-Kun Yen, Chien-Kai Ho, Jhan-Foug Yen, Shi-Wei Chen, Fan-Rui Fu, Yi-Tzu Lin, Cing-Hao Lin, Ajay Kumar, Yow-Ling Shiue