Hasil Pencarian - Chin-Li Kao

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  1. 1
    Investigation of Low-Pressure Sn-Passivated Cu-to-Cu Direct Bonding in 3D-Integration

    Investigation of Low-Pressure Sn-Passivated Cu-to-Cu Direct Bonding in 3D-Integration oleh Po-Yu Kung, Wei-Lun Huang, Chin-Li Kao, Yung-Sheng Lin, Yun-Ching Hung, C. R. Kao

    Diterbitkan 2022-11-01
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  2. 2
    Thermal stability and bonding interface in Cu/SiO2 hybrid bonding on nano-twinned copper

    Thermal stability and bonding interface in Cu/SiO2 hybrid bonding on nano-twinned copper oleh Jou-Chun Ou, Yi-Yun Tsai, Ting-Chun Lin, Chin-Li Kao, Shih-Chieh Hsiao, Fei-Ya Huang, Jui-Chao Kuo

    Diterbitkan 2022-06-01
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  3. 3
    A High Copper Concentration Copper-Quadrol Complex Electroless Solution for Chip Bonding Applications

    A High Copper Concentration Copper-Quadrol Complex Electroless Solution for Chip Bonding Applications oleh Jeng-Hau Huang, Po-Shao Shih, Vengudusamy Renganathan, Simon Johannes Gräfner, Yu-Chun Lin, Chin-Li Kao, Yung-Sheng Lin, Yun-Ching Hung, Chengheng Robert Kao

    Diterbitkan 2024-04-01
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