Hasil Pencarian - Chin Hao Tsai

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  1. 1
    Development of Ag–In Alloy Pastes by Mechanical Alloying for Die Attachment of High-Power Semiconductor Devices

    Development of Ag–In Alloy Pastes by Mechanical Alloying for Die Attachment of High-Power Semiconductor Devices oleh Chin-Hao Tsai, Wei-Chen Huang, Chengheng Robert Kao

    Diterbitkan 2022-02-01
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  2. 2
    Effects of bonding pressures on microstructure and mechanical properties of silver–tin alloy powders synthesized by ball milling for high-power electronics packaging

    Effects of bonding pressures on microstructure and mechanical properties of silver–tin alloy powders synthesized by ball milling for high-power electronics packaging oleh Wei Chen Huang, Chin Hao Tsai, Pei Tzu Lee, C.R. Kao

    Diterbitkan 2022-07-01
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  3. 3
    Long-Term Aging Study on the Solid State Interfacial Reactions of In on Cu Substrate

    Long-Term Aging Study on the Solid State Interfacial Reactions of In on Cu Substrate oleh Han-Tang Hung, Fu-Ling Chang, Chin-Hao Tsai, Chia-Yi Liao, C. R. Kao

    Diterbitkan 2023-09-01
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  4. 4
    Low-pressure micro-silver sintering with the addition of indium for high-temperature power chips attachment

    Low-pressure micro-silver sintering with the addition of indium for high-temperature power chips attachment oleh Chin-Hao Tsai, Wei-Chen Huang, Ly May Chew, Wolfgang Schmitt, Jiahui Li, Hiroshi Nishikawa, C.R. Kao

    Diterbitkan 2021-11-01
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  5. 5
    Low-temperature transient liquid phase bonding via electroplated Sn/In–Sn metallization

    Low-temperature transient liquid phase bonding via electroplated Sn/In–Sn metallization oleh Chin-Hao Tsai, Han-Tang Hung, Fu-Ling Chang, Steffen Bickel, Maik Müller, Iuliana Panchenko, Karlheinz Bock, C.R. Kao

    Diterbitkan 2022-07-01
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