Hasil Pencarian - Chengqiang Cui

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  1. 1
    A Mini Review on the Microvia Filling Technology Based on Printed Metal Nano/Microparticles

    A Mini Review on the Microvia Filling Technology Based on Printed Metal Nano/Microparticles oleh Guannan Yang, Guannan Yang, Shaogen Luo, Zhen Li, Yu Zhang, Yu Zhang, Chengqiang Cui, Chengqiang Cui

    Diterbitkan 2022-03-01
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  2. 2
    Research Progress on Rolling Forming of Tungsten Alloy

    Research Progress on Rolling Forming of Tungsten Alloy oleh Jun Cao, Jie Xia, Xiaoyu Shen, Kexing Song, Yanjun Zhou, Chengqiang Cui

    Diterbitkan 2024-09-01
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  3. 3
    Capillarity-promoted laser re-sintering of printed semisolid Cu nanoparticles for facile fabrication of conductive patterns with voidless structure and improved conductivity

    Capillarity-promoted laser re-sintering of printed semisolid Cu nanoparticles for facile fabrication of conductive patterns with voidless structure and improved conductivity oleh Guannan Yang, Quanzhen Li, Zehua Tang, Yujie Zeng, Yu Zhang, Jinfeng Li, Chengqiang Cui

    Diterbitkan 2022-05-01
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  4. 4
    Research Status of Manufacturing Technology of Tungsten Alloy Wire

    Research Status of Manufacturing Technology of Tungsten Alloy Wire oleh Jun Cao, Yongzhen Sun, Baoan Wu, Huiyi Tang, Yong Ding, Kexing Song, Chengqiang Cui

    Diterbitkan 2023-05-01
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  5. 5
    Understanding the relationship between particle size and ultrasonic treatment during the synthesis of metal nanoparticles

    Understanding the relationship between particle size and ultrasonic treatment during the synthesis of metal nanoparticles oleh Guannan Yang, Wei Lin, Haiqi Lai, Jin Tong, Junjun Lei, Maodan Yuan, Yu Zhang, Chengqiang Cui

    Diterbitkan 2021-05-01
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  6. 6
    Improved Anti-Vulcanization and Bonding Performance of a Silver Alloy Bonding Wire by a Cathodic Passivation Treatment with Palladium

    Improved Anti-Vulcanization and Bonding Performance of a Silver Alloy Bonding Wire by a Cathodic Passivation Treatment with Palladium oleh Guannan Yang, Zhiqiang Zhou, Haide Zhang, Yu Zhang, Zhen Peng, Pan Gong, Xin Wang, Chengqiang Cui

    Diterbitkan 2022-03-01
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  7. 7
    Study on Manufacturing Technology of Ultra-Thin/Narrow Bonding Cu Strip for Electronic Packaging

    Study on Manufacturing Technology of Ultra-Thin/Narrow Bonding Cu Strip for Electronic Packaging oleh Jun Cao, Junchao Zhang, Baoan Wu, Huiyi Tang, Yong Ding, Kexing Song, Guannan Yang, Chengqiang Cui

    Diterbitkan 2023-04-01
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  8. 8
    High Thermoelectric Performance Achieved in Sb-Doped GeTe by Manipulating Carrier Concentration and Nanoscale Twin Grains

    High Thermoelectric Performance Achieved in Sb-Doped GeTe by Manipulating Carrier Concentration and Nanoscale Twin Grains oleh Chao Li, Haili Song, Zongbei Dai, Zhenbo Zhao, Chengyan Liu, Hengquan Yang, Chengqiang Cui, Lei Miao

    Diterbitkan 2022-01-01
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  9. 9
    A Green and Facile Microvia Filling Method via Printing and Sintering of Cu-Ag Core-Shell Nano-Microparticles

    A Green and Facile Microvia Filling Method via Printing and Sintering of Cu-Ag Core-Shell Nano-Microparticles oleh Guannan Yang, Shaogen Luo, Tao Lai, Haiqi Lai, Bo Luo, Zebo Li, Yu Zhang, Chengqiang Cui

    Diterbitkan 2022-03-01
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  10. 10
    Study on Manufacturing Technology of Ag-8.5Au-3.5Pd Fine Alloy Wire

    Study on Manufacturing Technology of Ag-8.5Au-3.5Pd Fine Alloy Wire oleh Jun Cao, Junchao Zhang, Baoan Wu, Huiyi Tang, Changchun Lv, Kexing Song, Guannan Yang, Chengqiang Cui, Yangguang Gao

    Diterbitkan 2021-08-01
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  11. 11
    Gradient-Pattern Micro-Grooved Wicks Fabricated by the Ultraviolet Nanosecond Laser Method and Their Enhanced Capillary Performance

    Gradient-Pattern Micro-Grooved Wicks Fabricated by the Ultraviolet Nanosecond Laser Method and Their Enhanced Capillary Performance oleh Guanghan Huang, Jiawei Liao, Chao Fan, Shuang Liu, Wenjie Miao, Yu Zhang, Shiwo Ta, Guannan Yang, Chengqiang Cui

    Diterbitkan 2024-01-01
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  12. 12
    The effects of pressure, temperature, and depth/diameter ratio on the microvia filling performance of Ag-coated Cu micro-nanoparticles for advanced electronic packaging

    The effects of pressure, temperature, and depth/diameter ratio on the microvia filling performance of Ag-coated Cu micro-nanoparticles for advanced electronic packaging oleh Guannan Yang, Shaogen Luo, Bo Luo, Yan Zuo, Shiwo Ta, Tingyu Lin, Zhaohui Zhao, Yu Zhang, Chengqiang Cui

    Diterbitkan 2022-10-01
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  13. 13
    Synthesis of Imidazole-Compound-Coated Copper Nanoparticles with Promising Antioxidant and Sintering Properties

    Synthesis of Imidazole-Compound-Coated Copper Nanoparticles with Promising Antioxidant and Sintering Properties oleh Yu Zhang, Xianchong Yu, Ziyuan Chen, Song Wu, Haiqi Lai, Shiwo Ta, Tingyu Lin, Guannan Yang, Chengqiang Cui

    Diterbitkan 2023-11-01
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  14. 14
    Dynamic Modeling, Simulation, and Experimental Verification of a Wafer Handling SCARA Robot With Decoupling Servo Control

    Dynamic Modeling, Simulation, and Experimental Verification of a Wafer Handling SCARA Robot With Decoupling Servo Control oleh Yunbo He, Xiquan Mai, Chengqiang Cui, Jian Gao, Zhijun Yang, Kai Zhang, Xun Chen, Yun Chen, Hui Tang

    Diterbitkan 2019-01-01
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  15. 15
    Study on the effect of heat treatment on the microstructure and properties of C17300 beryllium copper alloy microwires

    Study on the effect of heat treatment on the microstructure and properties of C17300 beryllium copper alloy microwires oleh Jun Cao, Chong Li, Yongzhen Sun, Baoan Wu, Huiyi Tang, Xiaoyu Shen, Kexing Song, Yanjun Zhou, Chengqiang Cui

    Diterbitkan 2023-07-01
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